Increases in integrated circuit speeds and component densities have led to very high heat dissipations in electronic systems, making thermal considerations a potential limiting factor for performance. By performing thermal-flow simulations, ATA can provide you with valuable insight on the thermal characteristics of your system, enabling you to determine cooling and thermal management requirements and perform trade studies early in the design phase.
The accuracy of the simulations is enhanced by the ability to accurately model fans, vents, screens, blockages, power dissipations, and thermal resistances, as well as important geometric features. We can also perform flow measurement testing on either the actual system or a mock-up for model verification or final system qualification.