Due to restrictive thermal operating conditions of satellite components, another level of detail for the thermal analysis is often required. A shelf level thermal analysis will predict the unit mounting surface temperatures, verify the bulk zone temperatures calculated by the system level thermal analysis, and determine temperature variations within the shelf itself. ATA can provide you with valuable insight on the shelf level thermal characteristics of your satellites enabling you to determine cooling and thermal management requirements and perform parametric thermal studies early in satellite design phase.

Shelf level thermal analyses can be performed rapidly using SAMi™ software. Using an Excel Workbook® front end, SAMi™ allows the user to quickly create thermal models for rigidly constructed rectangular grids, ideal for the shelf analyst. Upon creation of the shelf model in the spreadsheet, TMG™ evaluates the model and returns a summary of the temperature values for each component. Additionally, once the model is created to SAMi™, it can be easily imported into I-DEAS®.